B29C 45/1468
Plants therefor
Official title: {Plants therefor}
B29C45/1468 (Plants therefor) appears on 14 US grants and 5 published applications in this corpus.
Search patents in B29C- Granted patents
- 14
- Published applications
- 5
- Assignees
- 8
- Inventors
- 40
- Latest grant
- 5 Sep 2023
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 1 | 1 |
| 2002 | 1 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 1 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Molded circuit board of camera module, manufacturing equipment and manufacturing method for molded circuit board5 Sep 2023US 11,745,401 B2Ningbo Sunny Opotech Co., Ltd.
- Resin molding machine22 Aug 2017US 9,738,014 B2Apic Yamada Corporation
- Resin molding machine and resin tablet feeding machine9 Nov 2004US 6,814,556 B2Apic Yamada Corporation
- Resin molding machine26 Feb 2002US 6,350,113 B1Apic Yamada Corporation
- Method of resin molding13 Feb 2001US 6,187,243 B1Apic Yamada Corporation
- Resin molding device, and method for producing resin molded article15 Jan 2026US 2026/0014744 A1Towa Corporation
- Molded Circuit Board Of Camera Module, Manufacturing Equipment And Manufacturing Method For Molded Circuit Board9 May 2019US 2019/0134866 A1Ningbo Sunny Opotech Co., Ltd.
- Resin molding machine31 May 2012US 2012/0135096 A1Apic Yamada Corporation
- Semiconductor device and apparatus for manufacturing same27 Feb 2003US 2003/0038363 A1Mitsubishi Denki Kabushiki Kaisha
- Resin molding machine and resin tablet feeding machine25 Oct 2001US 2001/0033876 A1Apic Yamada Corporation
Most cited
By later US patents
- Automatic molding machine using release film25US 5,891,483 AApic Yamada Corporation · 1999
- Method of resin molding23US 6,187,243 B1Apic Yamada Corporation · 2001
- Endless electrical connector21US 4,832,622 AAutosplice, Inc. · 1989
- Resin molding machine15US 6,350,113 B1Apic Yamada Corporation · 2002
- Method of encapsulating semiconductor chips12US 5,110,515 AHitachi, Ltd. · 1992