B29C 2045/14663
The mould cavity walls being lined with a film
Official title: {the mould cavity walls being lined with a film, e.g. release film}
B29C2045/14663 (The mould cavity walls being lined with a film) appears on 47 US grants and 35 published applications in this corpus.
Search patents in B29C- Granted patents
- 47
- Published applications
- 35
- Assignees
- 23
- Inventors
- 87
- Latest grant
- 6 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 3 | 0 |
| 1999 | 6 | 0 |
| 2000 | 1 | 0 |
| 2001 | 4 | 2 |
| 2002 | 6 | 4 |
| 2003 | 1 | 1 |
| 2004 | 3 | 0 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 0 | 2 |
| 2010 | 0 | 1 |
| 2011 | 1 | 0 |
| 2012 | 0 | 1 |
| 2013 | 1 | 0 |
| 2014 | 1 | 1 |
| 2015 | 0 | 2 |
| 2016 | 1 | 5 |
| 2017 | 1 | 2 |
| 2018 | 2 | 3 |
| 2019 | 2 | 4 |
| 2020 | 1 | 2 |
| 2021 | 4 | 0 |
| 2022 | 2 | 3 |
| 2023 | 2 | 1 |
| 2024 | 3 | 0 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Combination of mold and release film, release film, mold, and method for manufacturing molded article6 May 2025US 12,290,967 B2Kobayashi & Co., Ltd.
- Method of manufacturing a sensor device and moulding support structure2 Jul 2024US 12,024,418 B2Melexis Technologies SA
- Method for manufacturing resin molded product28 May 2024US 11,992,982 B2Towa Corporation
- Method for manufacturing resin molded product30 Apr 2024US 11,969,922 B2Towa Corporation
- Molded circuit board of camera module, manufacturing equipment and manufacturing method for molded circuit board5 Sep 2023US 11,745,401 B2Ningbo Sunny Opotech Co., Ltd.
- Method of manufacturing a sensor device and moulding support structure10 Aug 2023US 2023/0249962 A1Melexis Technologies SA
- Resin molding apparatus and method for manufacturing resin molded product26 May 2022US 2022/0161469 A1Towa Corporation
- Resin molding apparatus and method for manufacturing resin molded product26 May 2022US 2022/0161475 A1Towa Corporation
- Combination of mold and release film, release film, mold, and method for manufacturing molded article19 May 2022US 2022/0152882 A1Kobayashi & Co., Ltd.
- Method of manufacturing a sensor device and moulding support structure23 Jul 2020US 2020/0231432 A1Melexis Technologies SA
Most cited
By later US patents
- Method for molding semiconductor components76US 6,652,799 B2Micron Technology, Inc. · 2003
- Method of fabricating a molded package for micromechanical devices74US 6,489,178 B2Texas Instruments Incorporated · 2002
- Method of resin molding and resin molding machine for the same66US 5,824,252 AApic Yamada Corporation · 1998
- Apparatus for molding semiconductor components62US 6,439,869 B1Micron Technology, Inc. · 2002
- Production method for encapsulating a semiconductor device44US 5,846,477 ANitto Denko Corporation · 1998