Production method for encapsulating a semiconductor device
AssigneeNitto Denko Corporation
InventorsYuji Hotta, Hitomi Shigyo, Shinichi Ohizumi
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Abstract
A method of producing a semiconductor device by encapsulating a semiconductor element with a resin, which comprises disposing a semiconductor element with lead frames and an encapsulating resin in a state of being sandwiched between a pair of films on a molding mold having a port for setting the encapsulating resin, closing the mold, pressing the encapsulating resin between the films in a heated state by a plunger vertically moving in the pot, and injecting the molten encapsulating resin in the inside of the mold cavity from the pot portion through a runner portion to encapsulate the semiconductor element with the encapsulating resin.
Claims10
A method of producing a semiconductor device by encapsulating a semiconductor element with a resin comprising the steps of:
- providing a molding mold having a pot for receiving the encapsulating resin, at least one mold cavity, and at least one runner portion connecting said at least one mold cavity to said pot,
- placing a semiconductor element with lead frames and an encapsulating resin between a pair of films affixed to said molding mold,
- closing said molding mold,
- heating said encapsulating resin,
- pressing said encapsulating resin between said films with a plunger, and
- injecting the molten encapsulating resin in the inside of the mold cavity from said pot through the runner portion to encapsulate the semiconductor element with said encapsulating resin;
- wherein said films are in contact with said pot in said molding mold and are adsorbed onto the inside surface of said pot;
- wherein suction holes are formed in said plunger as the adsorption means of said films in contact with said pot portion, wherein said suction holes are open at the tip of said plunger such that said pot portion is in communication with an external suction source though said suction holes;
- wherein suction holes having a diameter of from 50 to 200 .mu.m are formed in said molds and said plunger;
- wherein said suction holes open to a space where the encapsulating resin is brought into contact with said films such that said space is in communication with an external suction source;
- and
- wherein after sucking said films to said mold, said semiconductor element with lead frames and said encapsulating resin are placed between said films, said mold is closed, and molding is carried out.
A method of producing a semiconductor device by encapsulating a semiconductor element with a resin comprising the steps of:
- placing a semiconductor element with lead frames between a pair of films affixed to a molding mold having a pot for receiving an encapsulating resin,
- closing said mold,
- injecting an encapsulating resin placed in the pot into a space between said films through a hole previously formed in one of said films by pressing said encapsulating resin with a plunger, and
- filling the inside of the mold cavity with said encapsulating resin to encapsulate the semiconductor element;
- wherein a heat-resistant material is linearly inserted in a ring form crossing runner portions near the pot to prevent the encapsulating resin from flowing into the space between the mold and the film before the mold is closed.
Dependencies are inferred from the claim text.