Resin molding apparatus and method for manufacturing resin molded product
AssigneeTowa Corporation
InventorsYoshito OKUNISHI, Fuyuhiko OGAWA, Hideyuki SAKAI
Life of this patent
Estimating the term…
Loading patent…
AssigneeTowa Corporation
InventorsYoshito OKUNISHI, Fuyuhiko OGAWA, Hideyuki SAKAI
Estimating the term…
Provided is a resin molding apparatus that can suppress a molding problem caused by a variation in a thickness of an object to be molded or suppress a variation in a thickness of a resin molded part, and can perform a mold releasing operation. A resin molding apparatus includes: a molding mold having one mold and the other mold; one mold wedge mechanism; and one mold cavity block driving mechanism. In a state that a height position of one mold cavity block is set using the one mold cavity block driving mechanism and a position in a direction away from the other mold in the one mold cavity block having been moved to the height position is fixed to be limited using the one mold wedge mechanism, a mold releasing operation can be performed using the one mold wedge mechanism and the one mold cavity block driving mechanism.
A resin molding apparatus, comprising:
Dependencies are inferred from the claim text.