Resin molding apparatus and method for manufacturing resin molded product
AssigneeTowa Corporation
InventorsYoshito OKUNISHI, Fuyuhiko OGAWA
Life of this patent
Estimating the term…
Loading patent…
AssigneeTowa Corporation
InventorsYoshito OKUNISHI, Fuyuhiko OGAWA
Estimating the term…
Provided is a resin molding apparatus that can reduce a variation in a thickness of a resin to be molded. A resin molding apparatus includes: a molding mold having one mold and the other mold; one mold wedge mechanism; and one mold cavity block driving mechanism. In a state that one mold cavity block is moved to a preset height position using the one mold cavity block driving mechanism and a position in a direction away from the other mold in the one mold cavity block having been moved to the height position is fixed to be limited using the one mold wedge mechanism, a resin is injected into one mold cavity, and thereafter resin molding can be performed by changing a depth of the one mold cavity using the one mold wedge mechanism and the one mold cavity block driving mechanism.
A resin molding apparatus, comprising:
Dependencies are inferred from the claim text.