Apparatus for molding semiconductor components

A molding apparatus for a semiconductor component comprising:

• a first mold chase comprising a surface and a mold cavity configured to form a molded portion of the semiconductor component and to receive a release film for releasing the molded portion from the mold cavity;
• a second mold chase configured for mating engagement with the first mold chase;
• and
• a movable pot proximate to the first mold chase comprising a reservoir configured to retain a molding compound, a plunger configured to inject the molding compound into the mold cavity, and a clamping surface for clamping the release film to the surface.

A molding apparatus for a semiconductor component comprising:

• a first mold chase comprising a surface and a first mold cavity for receiving a release film;
• a second mold chase comprising a second mold cavity configured for mating engagement with the first mold cavity for forming a molded portion of the semiconductor component and a runner in flow communication with the second mold cavity;
• and
• a movable pot mounted to the first mold chase comprising a reservoir configured to retain a molding compound, a plunger configured to inject the molding compound through the runner into the second mold cavity, and a clamping surface for clamping the release film to the surface.

A system for molding a semiconductor component comprising:

• a mold chase comprising a mold cavity configured to form a molded portion of the component;
• a pot mounted for axial movement relative to the mold chase, the pot comprising a reservoir configured to retain a molding compound, a plunger configured to inject the molding compound into the mold cavity, and a clamping surface for clamping a release film to the mold chase;
• and
• a drive mechanism for moving the pot.

A system for molding a semiconductor component comprising:

• a pair of opposing mold chases comprising mating mold cavities configured to form a molded portion of the component;
• a movable pot mounted to one of the mold chases and configured to inject a molding compound into the mold cavities, the movable pot configured to clamp a release film to the one of the mold chases to prevent the molding compound from wrinkling the release film, and to prevent the molding compound from seeping under the release film during injection into the mold cavities;
• and
• a drive mechanism attached to the movable pot configured to move the movable pot.