Semiconductor package injection molding mold, injection molding device and semiconductor package injection molding method

A semiconductor package injection molding device, comprising:

• a bottom mold;
• a top mold;
• a pressure source;
• pneumatic electric control valves;
• and
• a substrate,
• wherein an upper surface of the bottom mold is fitted with a lower surface of the substrate;
• the top mold is matched with the bottom mold;
• the top mold is provided with a cavity;
• the cavity is oriented towards an upper surface of the substrate and is used to accommodate a plastic package layer formed on the upper surface of the substrate;
• through holes that penetrate through the bottom mold are formed at positions corresponding to the substrate in the bottom mold;
• the through holes are connected with the pressure source through the pneumatic electric control valves respectively;
• the pressure source is configured to generate a positive pressure greater than an atmospheric pressure;
• the positive pressure on the lower surface of the substrate generated by the pressure source is used to balance a pressure on the upper surface of the substrate during injection molding;
• the lower surface of the substrate has bulges, and first through holes of the through holes are arranged at positions corresponding to the bulges;
• a size of each of the first through holes is greater than a size of each of the bulges;
• the pneumatic electric control valves are configured to control air pressures of the through holes such that air pressures corresponding to different through holes in the bottom mold are different, thereby forming different pressure distributions;
• and
• the air pressures of the first through holes at the positions corresponding to the bulges of the lower surface of the substrate are greater than the air pressures of second through holes of the through holes at other positions corresponding to the lower surface of the substrate.