B29C 2045/14672
Moulding with different depths of the upper and lower mould cavity
Official title: {moulding with different depths of the upper and lower mould cavity}
B29C2045/14672 (Moulding with different depths of the upper and lower mould cavity) appears on 8 US grants and 8 published applications in this corpus.
Search patents in B29C- Granted patents
- 8
- Published applications
- 8
- Assignees
- 4
- Inventors
- 12
- Latest grant
- 22 Jun 2021
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 1 |
| 2003 | 1 | 1 |
| 2004 | 0 | 1 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 1 |
| 2017 | 1 | 1 |
| 2018 | 1 | 0 |
| 2019 | 1 | 0 |
| 2020 | 0 | 1 |
| 2021 | 1 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Package including lead component having recess22 Jun 2021US 11,043,623 B2Nichia Corporation
- Package including lead component having recess10 Dec 2019US 10,505,090 B2Nichia Corporation
- Position detector apparatus17 Apr 2018US 9,944,002 B2Denso Corporation
- Method for manufacturing package, method for manufacturing light emitting device, package and light emitting device2 May 2017US 9,640,743 B2Nichia Corporation
- Overmolding encapsulation process and encapsulated article made therefrom2 Feb 2010US 7,655,508 B2Micron Technology, Inc.
- Method for manufacturing an interior component for vehicles26 Sep 2024US 2024/0316842 A1Lisa Dräxlmaier GmbH
- Package including lead component having recess5 Mar 2020US 2020/0075827 A1Nichia Corporation
- Package including lead component having recess13 Jul 2017US 2017/0200878 A1Nichia Corporation
- Method for manufacturing package, method for manufacturing light emitting device, package and light emitting device31 Mar 2016US 2016/0093785 A1Nichia Corporation
- Position detector apparatus5 Mar 2015US 2015/0061657 A1Denso Corporation
Most cited
By later US patents
- Asymmetric transfer molding method and an asymmetric encapsulation made therefrom31US 6,143,581 AMicron Technology, Inc. · 2000
- Overmolding encapsulation process and encapsulated article made therefrom5US 7,655,508 B2Micron Technology, Inc. · 2010
- Position detector apparatus2US 9,944,002 B2Denso Corporation · 2018
- Package including lead component having recess1US 10,505,090 B2Nichia Corporation · 2019
- Asymmetric transfer molding method and an asymmetric encapsulation made therefrom1US 6,605,331 B1Micron Technology, Inc. · 2003