Asymmetric transfer molding method and an asymmetric encapsulation made therefrom

A method of encapsulating an electrical device positioned on a flexible substrate, comprising:

• positioning a portion of the flexible substrate carrying the electrical device within a molding cavity defined by first and second molding sections, said substrate forming a seal with the first molding section;
• forming a seal between the substrate and the second molding section by filling the first molding section;
• and
• filling the second molding section.

A method, comprising:

• mounting an electrical device on a first surface of a flexible substrate such that leads from the electrical device extend to a second surface of the flexible substrate;
• connecting the leads to traces formed in the second surface of the flexible substrate;
• positioning a portion of the flexible substrate carrying the electrical device within a molding cavity defined by first and second molding sections, said substrate forming a seal with the first molding section;
• forming a seal between the substrate and the second molding section by filling the first molding section;
• and
• filling the second molding section.

A method of dynamic encapsulation, comprising:

• filling a first molding cavity positioned in a sealing relationship with an article to be encapsulated;
• dynamically creating a sealing relationship between the article and a second molding cavity;
• and
• filling the second molding cavity.

A method, comprising:

• mounting an electrical device to a first surface of a flexible substrate such that leads from the electrical device extend to a second surface of the flexible substrate;
• connecting the leads to traces formed in the second surface of the flexible substrate;
• positioning a portion of the flexible substrate carrying the electrical device within a molding cavity defined by first and second molding sections, said substrate forming a seal with the first molding section;
• filling the first molding cavity to dynamically create a sealing relationship between the flexible substrate and the second molding cavity;
• and
• filling the second molding cavity.

A method of asymmetric transfer molding, comprising:

• positioning an article to be encapsulated within a molding cavity defined by first and second mold sections, said article forming a seal with said first mold section;
• filling said first mold section by transfer molding, said first mold section defining a first surface area;
• and
• filling said second mold section by transfer molding, said second mold section defining a second surface area, said second surface area being smaller than said first surface area of said first mold section.