Back to results
US 6,605,331 B1Granted
Asymmetric transfer molding method and an asymmetric encapsulation made therefrom
AssigneeMicron Technology, Inc.
InventorsMark S. Johnson, Todd O. Bolken
Life of this patent
Estimating the term…
Abstract
A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.
Claims4
An asymmetrical encapsulation system, comprising:
- a flexible substrate;
- a device mounted upon said substrate;
- and
- an asymmetrical mold, said mold comprising:
- a first molding section;
- a second molding section, said first and second molding sections forming a cavity for receiving at least a portion of said flexible substrate carrying said device;
- said cavity designed such that a first surface area of the device exposed to the cavity defined by said first molding section is greater than a second surface area of the device exposed to the cavity defined by said second molding section;
- and
- at least one gate for injecting encapsulating material into said cavity, defined by said first molding section;
- wherein an opening is provided between the cavity defined by said first molding section and the cavity defined by said second molding section at a separate location from the location of said at least one gate.
7 more elements
Dependencies are inferred from the claim text.