Position detector apparatus

A method of manufacturing a position detector apparatus by using a metal mold, the position detector apparatus including a detector part having a magnetic detecting element, a wiring extending from the detector part, and a resin part molding at least one face of the detector part with the wiring, wherein a thickness of resin mold at a wiring side portion on the at least one face of the detector part is greater than a thickness of the resin mold on a side opposite to the wiring side portion on the at least one face of the detector part, the metal mold receiving a melted resin injected into a surrounding space around the at least one face of the detector part and the wiring, the metal mold including a large capacity cavity forming a thick resin part on the wiring side of the detector part, and a small capacity cavity for forming a thin resin part on the opposite-to-wiring side of the detector part, the method of manufacturing the position detector apparatus by using the metal mold comprising:

• positioning the detector part and the wiring in an inside of the metal mold;
• injecting the melted resin into the inside of the metal mold and flowing the melted resin from the large volume cavity to the small volume cavity;
• and
• removing the position detector apparatus from the metal mold after hardening of the melted resin.

A position detector apparatus comprising:

• a detector part including:
• a lead frame having a semiconductor element disposed thereon, and
• a resin frame molding together the semiconductor element and a part of the lead frame;
• a terminal connected to an end of the lead frame and protruding from the resin frame of the detector part;
• and
• a resin body having a thin-resin portion and a thick-resin portion, the thick-resin portion molding a terminal end of the detector part which is an end of the detector part that is closer to the terminal than the semiconductor element, and the thin-resin portion molding an end opposite to the terminal end of the detector part.