B29C 45/02
Transfer moulding, i.e. transferring the required volume of moulding material by a
Official title: Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
B29C45/02 (Transfer moulding, i.e. transferring the required volume of moulding material by a) appears on 467 US grants and 396 published applications in this corpus.
Search patents in B29C- Granted patents
- 467
- Published applications
- 396
- Assignees
- 266
- Inventors
- 947
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 6 | 0 |
| 1977 | 3 | 0 |
| 1978 | 7 | 0 |
| 1979 | 2 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 6 | 0 |
| 1983 | 3 | 0 |
| 1984 | 3 | 0 |
| 1985 | 5 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 9 | 0 |
| 1989 | 5 | 0 |
| 1990 | 6 | 0 |
| 1991 | 7 | 0 |
| 1992 | 11 | 0 |
| 1993 | 7 | 0 |
| 1994 | 9 | 0 |
| 1995 | 8 | 0 |
| 1996 | 8 | 0 |
| 1997 | 8 | 0 |
| 1998 | 10 | 0 |
| 1999 | 14 | 0 |
| 2000 | 15 | 0 |
| 2001 | 8 | 3 |
| 2002 | 13 | 12 |
| 2003 | 10 | 17 |
| 2004 | 15 | 10 |
| 2005 | 7 | 7 |
| 2006 | 5 | 21 |
| 2007 | 13 | 16 |
| 2008 | 5 | 14 |
| 2009 | 9 | 19 |
| 2010 | 14 | 15 |
| 2011 | 15 | 7 |
| 2012 | 7 | 11 |
| 2013 | 10 | 20 |
| 2014 | 12 | 9 |
| 2015 | 6 | 14 |
| 2016 | 14 | 23 |
| 2017 | 11 | 24 |
| 2018 | 18 | 19 |
| 2019 | 16 | 18 |
| 2020 | 14 | 16 |
| 2021 | 14 | 14 |
| 2022 | 15 | 22 |
| 2023 | 16 | 11 |
| 2024 | 13 | 19 |
| 2025 | 18 | 21 |
| 2026 | 7 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B29C 45/021Plunger drives37
- B29C 2045/025With the transfer plunger surface forming a part of the mould cavityIndexing code21
- B29C 2045/027Heat insulated cold transfer mouldingIndexing code6
- B29C 2045/024Transfer plungers and pots with an oblong cross sectionIndexing code3
- B29C 2045/022Stationary transfer plungersIndexing code2
Recent patents
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Most cited
By later US patents
- Method of resin sealing semiconductor devices184US 5,059,379 AMitsubishi Denki Kabushiki Kaisha · 1991
- Transfer molding apparatus having laminated chase block172US 5,871,782 ALG Semicon Co., Ltd. · 1999
- Coinjection of hollow articles and preforms108US 4,717,324 AHusky Injection Molding Systems Ltd. · 1988
- Manifold system having flow control87US 6,464,909 B1Synventive Molding Solutions, Inc. · 2002
- Molding system with integrated film heaters and sensors81US 6,764,297 B2Husky Injection Molding Systems Ltd. · 2004