B29C 2045/025
With the transfer plunger surface forming a part of the mould cavity
Official title: {with the transfer plunger surface forming a part of the mould cavity wall at the end of the plunger transfer movement}
B29C2045/025 (With the transfer plunger surface forming a part of the mould cavity) appears on 21 US grants and 19 published applications in this corpus.
Search patents in B29C- Granted patents
- 21
- Published applications
- 19
- Assignees
- 16
- Inventors
- 42
- Latest grant
- 15 Jul 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 2 |
| 2004 | 1 | 0 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 2 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 1 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 4 |
| 2021 | 2 | 3 |
| 2022 | 2 | 2 |
| 2023 | 3 | 2 |
| 2024 | 3 | 1 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Molded semiconductor device and manufacturing method of molded semiconductor device15 Jul 2025US 12,358,194 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for manufacturing carbon block filter22 Oct 2024US 12,122,108 B2Picogram Co., Ltd.
- Molding apparatus and manufacturing method of molded semiconductor device18 Jun 2024US 12,011,859 B2Taiwan Semiconductor Manufacturing Company.Ltd
- System and method for multi-material molding23 Jan 2024US 11,878,447 B2Arris Composites Inc.
- Molding apparatus and manufacturing method of molded semiconductor device22 Aug 2023US 11,731,327 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Molding apparatus and molded semiconductor device2 Oct 2025US 2025/0303621 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Molded semiconductor device and manufacturing method of molded semiconductor device5 Sep 2024US 2024/0293962 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Molding apparatus and manufacturing method of molded semiconductor device2 Nov 2023US 2023/0347561 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Equipment for manufacturing carbon block filter and method for manufacturing carbon block filter26 Oct 2023US 2023/0339156 A1Picogram Co., Ltd.
- Molding apparatus and manufacturing method of molded semiconductor device17 Nov 2022US 2022/0362975 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Compression molding apparatus33US 5,204,127 AComposite Products, Inc. · 1993
- Automated thermoset molding method17US 5,753,164 AThe Budd Company · 1998
- Molding apparatus with charge overflow14US 6,106,274 AThe Budd Company · 2000
- System for molding laminated articles of a thermoplastic resin8US 5,310,330 AKrauss-Maffei Aktiengesellschaft · 1994
- Method for composite flow molding6US 10,946,595 B2Arris Composites Inc. · 2021