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US 12,358,194 B2Granted
Molded semiconductor device and manufacturing method of molded semiconductor device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsSheng-Feng Weng, Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai, Chia-Min Lin
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Abstract
A molded semiconductor device includes a semiconductor device and a molding material encapsulating the semiconductor device, wherein an upper surface of the molding material is substantially coplanar with an upper surface of the semiconductor device and comprises a groove at least partially surrounding the upper surface of the semiconductor device.
Claims20
A molded semiconductor device, comprising:
- a semiconductor device;
- and
- a molding material encapsulating an outermost side surface of the semiconductor device, wherein an upper surface of the molding material is substantially coplanar with an upper surface of the semiconductor device and comprises a groove on the upper surface of the molding material and at least partially surrounding the upper surface of the semiconductor device.
A molded semiconductor device, comprising:
- a substrate;
- a semiconductor device mounted on the substrate;
- and
- a molding material disposed over the substrate and encapsulating an outermost side surface of the semiconductor device, wherein the molding material comprises a groove on a top surface of the molding material, and the groove at least partially surrounding and spaced apart from an upper surface of the semiconductor device from a top view, wherein an outermost side surface of the substrate is free of the molding material.
1 more element
A manufacturing method of a molded semiconductor device, comprising:
- mounting a semiconductor device over a substrate through a plurality of conductive terminals to form a package component;
- placing the package component in a molding apparatus, wherein the molding apparatus comprises a lower mold for carrying the package component, an upper mold covering the semiconductor device and a dynamic ring movably embedded in the upper mold and surrounding the semiconductor device;
- moving the dynamic ring relatively to the upper mold along a first direction;
- injecting a first part of a molding material into the molding apparatus;
- moving the dynamic ring relatively to the upper mold along a second direction opposite to the first direction;
- and
- injecting a second part of the molding material into the molding apparatus.
4 more elements
Dependencies are inferred from the claim text.