Molding apparatus with charge overflow

A molding apparatus comprising:

• a charge forming unit for forming a charge of resin having a plurality of reinforcing fibers, wherein the fibers are positioned in parallel horizontal planes;
• and
• a molding unit including an upper die and a lower die cooperating to form at least part of a mold cavity when closed;
• said lower die having an opening therein;
• a platform in the opening in the lower die;
• and moving means for moving the platform relative to the lower die;
• said moving means lowering the platform below the lower die to permit a charge to be loaded thereon;
• means for closing the upper and lower dies together to form the mold cavity;
• said moving means, thereafter, raising the platform towards the lower die to introduce the charge into the mold cavity so that the fibers are maintained in an orientation roughly parallel to the die surface to form a fiber reinforced part in which the fiber integrity is essentially undisturbed from initial charge forming through final curing;
• an overflow cavity receiving excess material from the mold cavity;
• an overflow pin displaced within said overflow cavity;
• and
• a pin biasing device attached to said overflow pin for upwardly biasing said overflow pin to a position level with a lower surface of said mold cavity until displaced by said excess material.