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US 5,871,782 AGranted
Transfer molding apparatus having laminated chase block
AssigneeLG Semicon Co., Ltd.
InventorSihn Choi
Life of this patent
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Abstract
An improved transfer molding apparatus has a laminated chase block with many sets, which is capable of fabricating a plurality of semiconductor packages. The apparatus includes an upper plate and a movable lower plate and a plurality of posts disposed between the upper and lower plates. A plurality of laminated chase blocks is fixed to the posts. A plurality of ejecting means are disposed at one side of the chase blocks and supply means concurrently supplies a molding compound to the plurality of chase blocks.
Claims22
A transfer molding apparatus, comprising:
- a first plate and a second plate, wherein one of the first and second plates is movable with respect the other of the first and second plates;
- a plurality of posts disposed between the first and second plates;
- a plurality of chase blocks connected to the posts, wherein the chase blocks are adapted to be moved between open and closed positions;
- a plurality of ejecting devices for ejecting molded articles from the plurality of chase blocks, wherein each ejecting device comprises a camshaft located in a chase block and at least one ejector pin that engages the camshaft, and wherein rotation of the camshaft causes movement of the at least one ejector pin.
1 more element
Dependencies are inferred from the claim text.