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US 2026/0146153 A1Published application
Resin composition for molding and electronic component device
AssigneeResonac Corporation
InventorsMika TANAKA, Yuma TAKEUCHI, Yuta SUKEGAWA, Shintaro OKADA
Life of this patent
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Abstract
A resin composition for molding includes: an epoxy resin containing at least one of a phenol novolac type epoxy resin with an epoxy equivalent of 156 g/eq to 250 g/eq and a cresol novolac type epoxy resin with an epoxy equivalent of 156 g/eq to 250 g/eq; an active ester compound; and an inorganic filler.
Claims8
A resin composition for molding comprising:
- an epoxy resin containing at least one of a phenol novolac type epoxy resin with an epoxy equivalent of 156 g/eq to 250 g/eq and a cresol novolac type epoxy resin with an epoxy equivalent of 156 g/eq to 250 g/eq;
- an active ester compound;
- and an inorganic filler.
Dependencies are inferred from the claim text.