B29C 2043/5825
Dimensions or shape
Official title: {dimensions or shape, e.g. size, thickness}
B29C2043/5825 (Dimensions or shape) appears on 79 US grants and 90 published applications in this corpus.
Search patents in B29C- Granted patents
- 79
- Published applications
- 90
- Assignees
- 67
- Inventors
- 222
- Latest grant
- 2 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 0 | 0 |
| 2001 | 2 | 1 |
| 2002 | 4 | 3 |
| 2003 | 2 | 3 |
| 2004 | 1 | 2 |
| 2005 | 3 | 2 |
| 2006 | 2 | 3 |
| 2007 | 4 | 8 |
| 2008 | 2 | 2 |
| 2009 | 1 | 2 |
| 2010 | 5 | 6 |
| 2011 | 1 | 4 |
| 2012 | 5 | 0 |
| 2013 | 0 | 0 |
| 2014 | 2 | 3 |
| 2015 | 2 | 4 |
| 2016 | 3 | 3 |
| 2017 | 1 | 3 |
| 2018 | 2 | 6 |
| 2019 | 3 | 6 |
| 2020 | 5 | 3 |
| 2021 | 4 | 4 |
| 2022 | 3 | 6 |
| 2023 | 4 | 3 |
| 2024 | 6 | 5 |
| 2025 | 3 | 3 |
| 2026 | 2 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Compression molding device2 Jun 2026US 12,643,268 B2Yamaha Robotics Co., Ltd.
- Method of preparation of a decorated wall or floor panels12 May 2026US 12,623,390 B2Akzenta Paneele + Profile GmbH
- Apparatus for molding pouch30 Dec 2025US 12,508,752 B2LG Energy Solution, Ltd.
- Rapidly pressing mixtures of paper and plastic to targeted thickness and density11 Feb 2025US 12,220,901 B2Continuus Materials Intellectual Property, LLC
- Conveyance apparatus, planarization apparatus, and article manufacturing method4 Feb 2025US 12,214,529 B2Canon Kabushiki Kaisha
- Leak-proof liquid metal/melamine insulating and thermally conductive film and preparation method thereof16 Jul 2026US 2026/0200189 A1Sichuan University
- Device, machine and method for coating a web-format carrier substrate with a dry film30 Apr 2026US 2026/0115793 A1Koenig & Bauer Aktiengesellschaft
- Conveyance apparatus, planarization apparatus, and article manufacturing method30 Apr 2026US 2026/0115978 A1Canon Kabushiki Kaisha
- Apparatus and Method for Molding Pouch12 Mar 2026US 2026/0070268 A1LG Energy Solution, Ltd.
- Method For Producing A Decorated Wall Or Floor Panel12 Mar 2026US 2026/0070274 A1Akzenta Paneele + Profile GmbH
Most cited
By later US patents
- Structure and method for automated assembly of a tab grid array package180US 5,843,808 AASAT Ltd. · 1998
- Method of manufacturing semiconductor devices and resin molding machine83US 6,344,162 B12002
- Enhancements in framed sheet processing57US 6,217,972 B1Tessera, Inc. · 2001
- Resin encapsulating method54US 4,954,308 ACitizen Watch Co., Ltd. · 1990
- Method for producing a semiconductor device43US 5,930,603 AFujitsu Limited · 1999