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US 4,954,308 AGranted
Resin encapsulating method
AssigneeCitizen Watch Co., Ltd.
InventorsIsao Yabe, Katsuji Komatsu, Hiroyuki Kaneko
Life of this patent
Estimating the term…
Abstract
A resin encapsulating method includes the steps of mounting a plate having a gate groove on a substrate to form a side gate, connected to the side surface of a cavity, between the plate and one of the upper and lower half molds, and filling a resin in the cavity.
Claims6
(New) A method of resin encapsulating an electronic part mounted on a flat resin circuit board having metallic wiring thereon, the method comprising the steps of:
- sandwiching said circuit board between a first mold and a second mold so as to position said electronic part in a cavity formed by at least the first mold wherein said electronic part is disposed within said cavity;
- selecting a gate plate having a gate groove formed on one surface thereof;
- arranging said gate plate adjacent to said cavity on an intermediate portion of a surface of the circuit board, the intermediate portion being spaced from the edge of the circuit board;
- orienting said gate plate such that said gate groove faces a surface of said mold opposite the surface on which said circuit board is disposed and forming a side gate between said first mold and said gate groove, thereby connecting said side gate to a side surface of said cavity at a position spaced from an upper surface of said circuit board;
- and
- filling said cavity with resin through said side gate.
3 more elements
Dependencies are inferred from the claim text.