Compression molding device

A compression molding device for compression-molding resin to a workpiece, in which a plurality of components are mounted on a carrier via a plurality of connection members, and manufacturing a plurality of packages each having at least one of the components sealed with the resin, the compression molding device comprising:

• a measuring part measuring a weight of the workpiece;
• a calculation part calculating a supply amount of the resin based on the weight of the workpiece measured by the measuring part;
• a supply part supplying the resin in the supply amount calculated by the calculation part;
• a thickness measurement part measuring a thickness of the package;
• and
• a molding die compression-molding the resin supplied by the supply part to the workpiece,
• wherein the calculation part calculates a total volume of a plurality of mounted objects, which comprise the plurality of components and the plurality of connection members, based on the weight of the workpiece, and
• calculates the supply amount of the resin based on the total volume of the plurality of mounted objects,
• wherein the calculation part calculates a total weight of the plurality of mounted objects based on the weight of the workpiece, and
• calculates the total volume of the plurality of mounted objects based on the total weight of the plurality of mounted objects,
• wherein the calculation part calculates a number of sets of the plurality of mounted objects from the total weight of the plurality of mounted objects based on a weight of mounted objects per set, and
• calculates the total volume of the plurality of mounted objects from the number of sets of the plurality of mounted objects based on a volume of mounted objects per set,
• wherein the measuring part measures a weight of a first trial workpiece in which a first number of sets of mounted objects are mounted on a reference carrier, and a weight of a second trial workpiece in which a second number of sets of mounted objects are mounted on the reference carrier,
• the thickness measurement part measures a thickness of a first trial assembly package in which a first supply amount of resin is molded to the first trial workpiece, and a thickness of a second trial assembly package in which the first supply amount of resin is molded to the second trial workpiece, and
• the calculation part calculates the volume of mounted objects per set by multiplying a thickness difference between the thickness of the first trial assembly package and the thickness of the second trial assembly package by an upper surface area of the first trial assembly package or the second trial assembly package, and dividing an obtained product by a difference in the number of sets between the first number of sets and the second number of sets, and
• calculates the weight of mounted objects per set by dividing a weight difference between the weight of the first trial workpiece and the weight of the second trial workpiece by the difference in the number of sets.