B24B 7/02
Involving a reciprocatingly-moved work-table
Official title: involving a reciprocatingly-moved work-table (involving a reciprocatingly-moved grinding wheel in combination with a stationary work-table B24B7/07)
B24B7/02 (Involving a reciprocatingly-moved work-table) appears on 38 US grants and 31 published applications in this corpus.
Search patents in B24B- Granted patents
- 38
- Published applications
- 31
- Assignees
- 30
- Inventors
- 93
- Latest grant
- 28 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 2 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 2 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 2 |
| 2004 | 1 | 1 |
| 2005 | 1 | 1 |
| 2006 | 1 | 1 |
| 2007 | 2 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 2 |
| 2012 | 0 | 2 |
| 2013 | 3 | 0 |
| 2014 | 1 | 2 |
| 2015 | 0 | 2 |
| 2016 | 4 | 1 |
| 2017 | 0 | 2 |
| 2018 | 1 | 1 |
| 2019 | 2 | 1 |
| 2020 | 1 | 1 |
| 2021 | 0 | 0 |
| 2022 | 0 | 2 |
| 2023 | 0 | 3 |
| 2024 | 1 | 2 |
| 2025 | 3 | 2 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Processing system28 Jul 2026US 12,691,545 B2Tokyo Seimitsu Co., Ltd.
- Substrate processing apparatus and substrate processing method12 May 2026US 12,623,313 B2Tokyo Electron Limited
- Creep feed grinding apparatus5 May 2026US 12,617,054 B2Deckers Outdoor Corporation
- Manufacturing method for a substrate wafer5 Aug 2025US 12,377,509 B2Shin-Etsu Handotai Co., Ltd.
- Grinding apparatus3 Jun 2025US 12,318,886 B2Okamoto Machine Tool Works, Ltd.
- Flat grinding machine with laser position measurement in the longitudinal axis17 Sep 2026US 2026/0273689 A1Ziersch GmbH
- Polishing head, polishing device provided with same, and substrate processing device30 Apr 2026US 2026/0115859 A1SCREEN Holdings Co., Ltd.
- Grinding apparatus20 Feb 2025US 2025/0058428 A1Okamoto Machine Tool Works, Ltd.
- Substrate polishing method, substrate polishing apparatus, and computer-readable storage medium storing program23 Jan 2025US 2025/0025984 A1Ebara Corporation
- Processing system6 Jun 2024US 2024/0181589 A1Tokyo Seimitsu Co., Ltd.
Most cited
By later US patents
- Workpiece conditioning grinder control system15US 4,248,019 AWestern Gear Corporation · 1981
- Grinding machine14US 4,890,420 A1990
- Surface grinding machine10US 4,485,594 ABrown & Sharpe Manufacturing Company · 1984
- Grinding wheel and grinding method7US 10,112,285 B2Disco Corporation · 2018
- Film image removal process and apparatus6US 4,201,015 A1980