Polishing head, polishing device provided with same, and substrate processing device
AssigneeSCREEN Holdings Co., Ltd.
InventorsHiroaki ISHII, Junichi ISHII
Life of this patent
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Abstract
Dust particles generated on a back surface of a substrate as a result of polishing by a polishing tool are also forced out toward an outer periphery of the polishing tool by centrifugal force. Then, nitrogen gas is ejected from an ejection port. This forces the dust particles adhering to the back surface of the substrate to separate from the back surface of the substrate. The dust particles are sucked through a suction port. This makes the dust particles less likely to remain on the back surface of the substrate, so that it is possible to increase the rate of removal of the dust particles generated as a result of polishing.
Claims9
A polishing head that polishes a substrate, comprising:
- a polishing tool including a resin body in which abrasive grains are dispersed;
- an ejection port through which gas is ejected toward dust particles generated as a result of polishing by the polishing tool;
- and
- a suction port through which the dust particles generated as a result of polishing by the polishing tool are sucked.
Dependencies are inferred from the claim text.