Grinding apparatus
AssigneeOkamoto Machine Tool Works, Ltd.
InventorsTetsuyuki Watanabe, Keiji Tsuchiya
Life of this patent
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AssigneeOkamoto Machine Tool Works, Ltd.
InventorsTetsuyuki Watanabe, Keiji Tsuchiya
Estimating the term…
Provided is a grinding apparatus that can efficiently and accurately measure the position of a work surface of a workpiece without preliminary preparations. Included are: a work table (14) configured to hold a workpiece (W); a grinding wheel (10) configured to grind the workpiece (W) while rotating; and a detection sensor (20) configured to detect the position of a work surface of the workpiece (W) in contact with the work surface, and relative positions of the detection sensor (20) and the work table (14) are changed by a manual operation, and the detection sensor (20) is brought into contact with the workpiece (W) to measure the workpiece (W). Consequently, it is possible to omit preliminary preparations for measurement such as creation of an NC program, initial settings, and operation confirmation and perform a highly efficient measurement with a significantly reduced time for the preliminary preparations.
A grinding apparatus comprising:
A grinding apparatus comprising:
Dependencies are inferred from the claim text.