Substrate polishing method, substrate polishing apparatus, and computer-readable storage medium storing program

A substrate polishing apparatus comprising:

• a polishing module configured to polish a substrate with a polishing tape;
• and
• a control system including a database and an arithmetic device,
• wherein the control system is configured to:
• store, in the database, an actual polishing condition for at least one substrate that has been polished in the past and an actual amount of use of a polishing tape under the actual polishing condition, with the actual polishing condition and the actual amount of use associated with each other;
• search the database for an actual polishing condition that matches a preset polishing condition for a polishing-target substrate before polishing of the polishing-target substrate;
• determine a predicted amount of use of the polishing tape necessary for polishing the polishing-target substrate which is an actual amount of use of the polishing tape associated with the actual polishing condition that matches the preset polishing condition;
• compare a remaining amount of the polishing tape to be used for polishing of the polishing-target substrate with the determined predicted amount of use;
• and
• when the remaining amount of the polishing tape is equal to or larger than the predicted amount of use, instruct the polishing module to polish the polishing-target substrate.

A computer-readable storage medium storing a program for instructing a control system to perform the steps of:

• storing, in the database, an actual polishing condition for at least one substrate that has been polished in the past and an actual amount of use of a polishing tape under the actual polishing condition, with the actual polishing condition and the actual amount of use associated with each other;
• searching the database for an actual polishing condition that matches a preset polishing condition for a polishing-target substrate before polishing of the polishing-target substrate;
• determining a predicted amount of use of the polishing tape necessary for polishing the polishing-target substrate which is an actual amount of use of the polishing tape associated with the actual polishing condition that matches the preset polishing condition;
• comparing a remaining amount of the polishing tape to be used for polishing of the polishing-target substrate with the determined predicted amount of use;
• and
• when the remaining amount of the polishing tape is equal to or larger than the predicted amount of use, instructing a polishing module to polish the polishing-target substrate.