Processing system
AssigneeTokyo Seimitsu Co., Ltd.
InventorHajime Akahori
Life of this patent
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Abstract
A processing system capable of processing a workpiece with high accuracy. A tilting device capable of tilting a rotation axis 3a of a chuck 3 holds a workpiece W. A film thickness measurement device 7 measures a film thickness of the workpiece W after fine grinding in a non-contact manner. A control device 8 operates a shape of the workpiece W after fine grinding on the basis of a measurement value of the film thickness measurement device 7, calculates a tilt angle of the tilting device such that a difference between a maximum thickness and a minimum thickness of the workpiece W after the fine grinding decreases, and tilts the chuck 3 by the tilt angle such that the workpiece W after the fine grinding is reprocessed by rough grinding, intermediate grinding, and fine grinding in this order with the chuck 3 tilted by the tilt angle.
Claims2
A processing system that processes a workpiece by pre-grinding and fine grinding in this order, the processing system comprising:
- a tilting device capable of tilting a rotation axis of a chuck that holds the workpiece;
- a measurement device that measures film thicknesses of a fine-ground workpiece at a plurality of measurement points in a non-contact manner;
- and
- a control device that calculates a shape of the fine-ground workpiece on the basis of a measurement value of the measurement device, calculates a tilt angle of the tilting device such that a difference between a maximum thickness and a minimum thickness of the fine-ground workpiece decreases, and tilts the chuck by the tilt angle,
- wherein the fine-ground workpiece is reprocessed by pre-grinding and fine grinding in this order with the chuck tilted by the tilt angle.
Dependencies are inferred from the claim text.