B24B 49/05
Including the measurement of a first workpiece already machined and of another
Official title: including the measurement of a first workpiece already machined and of another workpiece being machined and to be matched with the first one
B24B49/05 (Including the measurement of a first workpiece already machined and of another) appears on 20 US grants and 23 published applications in this corpus.
Search patents in B24B- Granted patents
- 20
- Published applications
- 23
- Assignees
- 13
- Inventors
- 50
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
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| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
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| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 2 | 0 |
| 2004 | 0 | 0 |
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| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 1 |
| 2014 | 1 | 1 |
| 2015 | 1 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 1 |
| 2018 | 0 | 1 |
| 2019 | 1 | 4 |
| 2020 | 2 | 2 |
| 2021 | 1 | 2 |
| 2022 | 2 | 2 |
| 2023 | 2 | 1 |
| 2024 | 1 | 3 |
| 2025 | 3 | 2 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
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Most cited
By later US patents
- Method of modeling and controlling the endpoint of chemical mechanical polishing operations performed on a process layer, and system for accomplishing same10US 6,534,328 B1Advanced Micro Devices, Inc. · 2003
- Manufacturing a semiconductor wafer according to the process time by process tool6US 6,514,861 B1ProMOS Technologies Inc. · 2003
- Real time profile control for chemical mechanical polishing5US 10,562,148 B2APPLIED Materials.Inc. · 2020
- Polishing method and polishing apparatus2US 10,399,203 B2Ebara Corporation · 2019
- Wafer thinning apparatus having feedback control and method of using2US 10,643,853 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2020