Manufacturing a semiconductor wafer according to the process time by process tool
AssigneeProMOS Technologies Inc.
InventorsMing-Cheng Yang, Jun-Yi Lee, Yun-Yu Chan, Sheng-Tsaing Tseng
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Abstract
A semiconductor process for manufacturing a wafer. First, a previously predicted process rate and a previously measured process rate are provided by a process tool. Next, a presently predicted process rate is obtained by a first linear equation having a first variable weighting factor using the previously predicted process rate and the previously measured process rate as variables. Next, a process time is obtained according to the presently predicted process rate and a predetermined process target to input to the process tool. Finally, the wafer is manufactured according to the process time by the process tool.
Claims20
A semiconductor process for manufacturing at least one wafer, comprising steps of:
- providing a previously predicted process rate and a previously measured process rate by a process tool;
- obtaining a presently predicted process rate by a first linear equation having a first variable weighting factor using the previously predicted process rate and the previously measured process rate as variables;
- obtaining a process time according to the presently predicted process rate and a predetermined process target to input to the process tool;
- and
- manufacturing the wafer according to the process time by the process tool.
A semiconductor process for polishing at least one wafer, comprising steps of:
- providing a previously predicted removal rate RR* (t−1) and a previously measured removal rate RR(t−1) by a process tool having a polishing pad;
- obtaining a presently predicted removal rate RR*(t) by a first linear equation having a first variable weighting factor using the previously predicted removal rate and the previously measured removal rate as variables;
- obtaining a polishing time according to the presently predicted removal rate and a predetermined polishing thickness to input to the process tool;
- and
- polishing the wafer according to the polishing time by the process tool.
Dependencies are inferred from the claim text.