B24B 37/02
Designed for working surfaces of revolution
Official title: designed for working surfaces of revolution
B24B37/02 (Designed for working surfaces of revolution) appears on 95 US grants and 99 published applications in this corpus.
Search patents in B24B- Granted patents
- 95
- Published applications
- 99
- Assignees
- 72
- Inventors
- 248
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 4 | 0 |
| 2001 | 5 | 1 |
| 2002 | 1 | 0 |
| 2003 | 2 | 0 |
| 2004 | 0 | 1 |
| 2005 | 0 | 4 |
| 2006 | 4 | 3 |
| 2007 | 2 | 7 |
| 2008 | 3 | 4 |
| 2009 | 2 | 4 |
| 2010 | 4 | 3 |
| 2011 | 3 | 7 |
| 2012 | 2 | 4 |
| 2013 | 4 | 4 |
| 2014 | 3 | 4 |
| 2015 | 5 | 3 |
| 2016 | 5 | 5 |
| 2017 | 5 | 7 |
| 2018 | 5 | 4 |
| 2019 | 5 | 6 |
| 2020 | 1 | 3 |
| 2021 | 4 | 3 |
| 2022 | 0 | 3 |
| 2023 | 5 | 6 |
| 2024 | 3 | 6 |
| 2025 | 4 | 5 |
| 2026 | 5 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Chip treating method23 Jun 2026US 12,666,923 B2Disco Corporation
- Grinding method for slice wafer7 Apr 2026US 12,594,640 B2Disco Corporation
- Maintaining valve components3 Feb 2026US 12,539,576 B2Saudi Arabian Oil Company
- Grinding tool kit, apparatus and method for finish machining of rolling surface of bearing roller6 Jan 2026US 12,515,291 B2Tianjin University
- Semiconductor processing tool and methods of operation6 Jan 2026US 12,519,020 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method and Apparatus for Generating a Reciprocating Sanding or Polishing Path8 Oct 2026US 2026/0307199 A1ABB Schweiz AG
- Semiconductor processing tool and methods of operation30 Apr 2026US 2026/0123360 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Ball magazine for a device for lapping and/or grinding balls25 Dec 2025US 2025/0387864 A1
- Ball guiding device for an apparatus for lapping and/or grinding balls25 Dec 2025US 2025/0387865 A1
- Bevel edge removal methods, tools, and systems9 Oct 2025US 2025/0316505 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Spherical lapping method39US 6,077,148 ADePuy Orthopaedics, Inc. · 2000
- Polishing method, polishing device, glass substrate for magnetic recording medium, and magnetic recording medium37US 6,280,294 B1Hoya Corporation · 2001
- Polishing apparatus and substrate processing apparatus24US 7,682,225 B2Ebara Corporation · 2010
- Wafer processing method and equipment therefor20US 5,882,539 AShin-Etsu Handotai Co., Ltd. · 1999
- Magnetic float polishing of magnetic materials15US 5,957,753 AThe Board of Regents for Oklahoma State University · 1999