Wafer processing method and equipment therefor
AssigneeShin-Etsu Handotai Co., Ltd.
InventorsFumihiko Hasegawa, Yasuyoshi Kuroda, Masayuki Yamada
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Abstract
A wafer processing method which can polish the chamfered portion of a wafer quickly, is disclosed. The processing method comprises the steps of: chamfering a peripheral portion of a wafer obtained by slicing an ingot, by grinding; lapping the wafer; etching the chamfered or lapped wafer; thereafter honing the entirety of the chamfered peripheral portion of the wafer by using a grinding stone while applying a predetermined load to the grinding stone; and thereafter polishing the entirety of the chamfered peripheral portion and the front and rear surfaces of the wafer.
Claims24
A wafer processing method comprising the steps of:
- chamfering a peripheral portion of a wafer by grinding;
- lapping the wafer before or after the chamfering step;
- etching the chamfered and lapped wafer;
- subsequently honing a deformation in a sectional shape of an etched peripheral portion of the wafer, the deformation being generated in the lapping or etching step;
- and
- polishing an entirety of the honed and etched peripheral portion of the wafer.
A wafer processing method comprising the steps of:
- chamfering a peripheral portion of a wafer by grinding;
- lapping the wafer before or after the chamfering step;
- etching the chamfered and lapped wafer;
- subsequently grinding a deformation in a sectional shape of the etched peripheral portion of the wafer, the deformation being generated in the lapping or etching step;
- and
- polishing an entirety of the ground peripheral portion of the wafer.
A wafer processing equipment comprising:
- a grinding apparatus for grinding a peripheral portion of a wafer;
- and
- a polishing apparatus for continuously polishing the peripheral portion of the wafer ground by the grinding apparatus.
Dependencies are inferred from the claim text.