B24B 37/022
Characterised by the movement of the work between two lapping plates
Official title: {characterised by the movement of the work between two lapping plates}
B24B37/022 (Characterised by the movement of the work between two lapping plates) appears on 4 US grants and 4 published applications in this corpus.
Search patents in B24B- Granted patents
- 4
- Published applications
- 4
- Assignees
- 5
- Inventors
- 10
- Latest grant
- 19 May 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2016 | 0 | 1 |
| 2017 | 2 | 2 |
| 2018 | 1 | 0 |
| 2019 | 0 | 1 |
| 2020 | 1 | 0 |
By publication year.
Recent patents
- One or more charging members used in the manufacture of a lapping plate, and related apparatuses and methods of making19 May 2020US 10,654,146 B2Seagate Technology LLC
- Cylindrical-component grinding device, and workpiece advancing apparatus and grinding method thereof2 Jan 2018US 9,855,635 B2Tianjin University
- Double-disc straight groove cylindrical-component surface grinding disc12 Dec 2017US 9,839,987 B2Tianjin University
- Wafer polishing apparatus29 Aug 2017US 9,744,641 B2LG Siltron Inc.
- One or more charging members used in the manufacture of a lapping plate, and related apparatuses and methods of making25 Jul 2019US 2019/0224806 A1Seagate Technology LLC
- Cylindrical-component grinding device, and workpiece advancing apparatus and grinding method thereof28 Sep 2017US 2017/0274494 A1Tianjin University
- Double-disc straight groove cylindrical-component surface grinding disc28 Sep 2017US 2017/0274499 A1Tianjin University
- Wafer polishing apparatus17 Mar 2016US 2016/0074990 A1LG Siltron Inc.
Most cited
By later US patents
No patent in this class has been cited by a later US patent yet.