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US 9,744,641 B2Granted
Wafer polishing apparatus
AssigneeLG Siltron Inc.
InventorKee Yun Han
Life of this patent
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Abstract
A wafer polishing apparatus includes a lower surface plate, an upper surface plate disposed over the lower surface plate, a carrier disposed between the lower surface plate and the upper surface plate and containing a wafer, and a lift unit lifting the carrier such that an upper surface of the carrier contacts a lower surface of the upper surface plate or lowering the carrier such that a lower surface of the carrier contacts an upper surface of the lower surface plate.
Claims17
A wafer polishing apparatus comprising:
- a lower surface plate;
- an upper surface plate disposed over the lower surface plate;
- a sun gear disposed at a center of the lower surface plate;
- an internal gear disposed around the periphery of the lower surface plate;
- a carrier disposed between the lower surface plate and the upper surface plate for containing a wafer, the carrier including a gear formed around an outer circumferential surface thereof and engaging with the sun gear and the internal gear;
- and
- a lift unit configured to lift the sun gear and the internal gear such that an upper surface of the carrier contacts a lower surface of the upper surface plate or configured to lower the sun gear and the internal gear such that a lower surface of the carrier contacts an upper surface of the lower surface plate.
4 more elements
A wafer polishing apparatus comprising:
- a lower surface plate;
- an upper surface plate disposed over the lower surface plate;
- a sun gear disposed at a center of the lower surface plate;
- an internal gear disposed around the periphery of the lower surface plate;
- a carrier disposed between the lower surface plate and the upper surface plate and containing a wafer, the carrier including a gear formed around an outer circumferential surface thereof and engaging with the sun gear and the internal gear;
- a lift unit configured to lift the sun gear and the internal gear such that an upper surface of the carrier contacts a lower surface of the upper surface plate or configured to lower the sun gear and the internal gear such that a lower surface of the carrier contacts an upper surface of the lower surface plate;
- and
- a control unit to control the lift unit to cause the carrier to be lifted or lowered,
- wherein the control unit controls the lift unit to cause a first surface of the carrier to contact one of a first surface of the upper surface plate and a first surface of the lower surface plate in a first polishing operation and to cause a second surface of the carrier to contact the other of the first surface of the upper surface plate and the first surface of the lower surface plate in a second polishing operation.
6 more elements
Dependencies are inferred from the claim text.