Polishing apparatus and substrate processing apparatus

A substrate processing apparatus comprising:

• a polishing unit including a polishing tape, said polishing unit configured to polish a bevel portion of a substrate by bringing said polishing tape into sliding contact with the bevel portion of the substrate;
• a cleaning unit configured to clean at least the bevel portion of the substrate;
• a drying unit configured to dry the substrate which has been cleaned by said cleaning unit;
• a transfer robot configured to transfer the dried substrate to a wafer cassette;
• a first partition dividing an internal space of said substrate processing apparatus into a transferring area in which said transfer robot is disposed and a cleaning area in which said cleaning unit and said drying unit are disposed;
• and
• a second partition dividing the internal space of said substrate processing apparatus into said cleaning area and a polishing area in which said polishing unit is disposed,
• wherein an internal pressure of said polishing area is set to be lower than an internal pressure of said cleaning area, and an internal pressure of said transferring area is set to be higher than the internal pressure of said cleaning area.