B24B 27/0633
Using a cutting wire
Official title: {using a cutting wire}
B24B27/0633 (Using a cutting wire) appears on 97 US grants and 118 published applications in this corpus.
Search patents in B24B- Granted patents
- 97
- Published applications
- 118
- Assignees
- 67
- Inventors
- 271
- Latest grant
- 4 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 2 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 2 |
| 2007 | 2 | 4 |
| 2008 | 3 | 2 |
| 2009 | 0 | 5 |
| 2010 | 2 | 8 |
| 2011 | 5 | 7 |
| 2012 | 6 | 10 |
| 2013 | 4 | 12 |
| 2014 | 8 | 9 |
| 2015 | 7 | 12 |
| 2016 | 9 | 11 |
| 2017 | 7 | 4 |
| 2018 | 8 | 7 |
| 2019 | 5 | 5 |
| 2020 | 3 | 2 |
| 2021 | 3 | 5 |
| 2022 | 2 | 4 |
| 2023 | 5 | 0 |
| 2024 | 5 | 3 |
| 2025 | 2 | 2 |
| 2026 | 1 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Continuous cutting horizontal multi-wire stone cutting machine4 Aug 2026US 12,697,752 B2Rock-It Natural Stone, Inc.
- Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon25 Nov 2025US 12,479,128 B2Siltronic AG
- Method for slicing ingot and wire saw7 Jan 2025US 12,186,939 B2Shin-Etsu Handotai Co., Ltd.
- Wire saw having dust collecting apparatus8 Oct 2024US 12,109,729 B2Egun Co., Ltd.
- Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon10 Sep 2024US 12,083,705 B2Siltronic AG
- Continuous cutting horizontal multi-wire stone cutting machine21 May 2026US 2026/0138306 A1Rock-It Natural Stone, Inc.
- Cutting-off and grinding integrated machine and control method therefor19 Mar 2026US 2026/0077446 A1Fujian Skystone Intelligent Equipment Co., Ltd.
- Semiconductor Crystal Wafer Manufacturing Device and Manufacturing Method8 May 2025US 2025/0144845 A1DryChemicals Co., Ltd.
- Method for cutting silicon ingot13 Feb 2025US 2025/0050542 A1Sumco Corporation
- Wire saw abnormality diagnosis device and method26 Sep 2024US 2024/0316664 A1Komatsu Ntc Ltd.
Most cited
By later US patents
- Oscillatory abrasive cable power saw74US 5,239,978 AThe United States of America as represented by the Secretary of the Navy · 1993
- Abrasive article and method of forming48US 9,375,826 B2Saint-Gobain Abrasifs · 2016
- Abrasive articles including abrasive particles bonded to an elongated substrate body having a barrier layer, and methods of forming thereof38US 9,211,634 B2Saint-Gobain Abrasifs · 2015
- Wire-saw and its manufacturing method31US 6,070,570 AOsaka Diamond Industrial Co., Ltd. · 2000
- Multi-wire saw24US 7,306,508 B2Mitsubishi Denki Kabushiki Kaisha · 2007