Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon
AssigneeSiltronic AG
InventorsAxel Beyer, Stefan Welsch
Life of this patent
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Abstract
Semiconductor wafers are produced from a workpiece by means of a wire saw, by feeding the workpiece through an arrangement of wires tensioned between wire guide rollers and divided into wire groups, the wires moving in a running direction producing kerfs as wires engage the workpiece. For each of the wire groups, a placement error of the kerfs of the wire groups determined, and for each of the wire groups compensating movements of the wires of the wire group are induced as a function of the placement error, in a direction perpendicular to the running direction of the wires during feeding of the workpiece through the arrangement of wires, by activating at least one drive element.
Claims11
A method for producing semiconductor wafers from a workpiece by processing the workpiece by means of a wire saw, comprising:
- feeding the workpiece through an arrangement of wires which are tensioned between wire guide rollers while being divided into wire groups and move in a running direction;
- producing kerfs when the wires engage the workpiece;
- for each of the wire groups, determining a placement error of the kerfs of the wire group;
- and
- for each of the wire groups, inducing a compensating movement of the wires of the wire group independently of other wire groups as a function of the determined placement error of the kerfs of the wire group, in a direction perpendicular to a running direction of the wires of the wire group during the feeding of the workpiece through the arrangement of wires, by activating at least one wire group drive element.
A wire saw for producing semiconductor wafers by processing a workpiece, comprising:
- wire guide rollers, between which wires are tensioned to form an arrangement of wires which move in a running direction and, are divided into wire groups;
- a feed device for feeding the workpiece through the arrangement of wires, producing kerfs as the wires engage the workpiece;
- drive elements, at least one of which is assigned to each of the wire groups, which move the wires of the assigned wire group;
- and
- a control unit which activates the drive elements in response to a determined placement error of the kerfs of the wire groups, the control unit activating the at least one drive element, which is assigned to the wire group having the determined placement error, so that the wires of the wire group execute a compensating movement independent of other wire groups perpendicular to the running direction.
Dependencies are inferred from the claim text.