Method for slicing ingot and wire saw
AssigneeShin-Etsu Handotai Co., Ltd.
InventorKeiichi Kanbayashi
Life of this patent
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Abstract
A method for slicing an ingot, including: forming a wire row by a wire spirally wound between a plurality of wire guides and configured to travel in an axial direction; and pressing an ingot against the wire row while supplying a contact portion between the ingot and the wire with a slurry from a nozzle, thereby slicing the ingot into wafers. The slurry is supplied such that slurries whose temperatures are separately controlled by two or more lines of heat exchangers are respectively supplied from two or more sections of the nozzle which are orthogonal to a travelling direction of the wire row. Consequently, a wire saw and a method for slicing an ingot are provided which enable separate control of wafer shapes depending on ingot-slicing positions.
Claims14
A method for slicing a first ingot, comprising:
- forming a wire row by a wire spirally wound between a plurality of wire guides, the wire being configured to travel in an axial direction of the wire;
- and
- pressing the first ingot against the wire row while supplying a contact portion between the first ingot and the wire with slurries from a nozzle, thereby slicing the first ingot into wafers, wherein
- the slurries are supplied such that slurries whose temperatures are separately controlled by two or more lines of heat exchangers are respectively supplied from two or more divided sections of the nozzle, the two or more divided sections of the nozzle being arranged adjacent to each other along a direction orthogonal to the axial direction of the wire.
A wire saw comprising:
- a wire row formed of a wire spirally wound between a plurality of wire guides, the wire being configured to travel in an axial direction of the wire;
- an ingot-feeding means configured to press a first ingot against the wire row while holding the first ingot;
- and
- a nozzle configured to supply slurries to a contact portion between the first ingot and the wire, wherein
- the ingot-feeding means presses the first ingot against the wire row while the nozzle supplies the slurries to the contact portion between the first ingot and the wire, thereby slicing the first ingot into wafers,
- the wire saw comprises two or more lines of heat exchangers configured to separately control a temperature of each slurry,
- the nozzle is divided in two or more sections arranged adjacent to each other along a direction orthogonal to the axial direction of the wire, and
- the two or more sections of the nozzle are respectively supplied with the separately controlled slurries from the heat exchangers.
Dependencies are inferred from the claim text.