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AssigneesSumitomo Electric Industries, Ltd., Osaka Diamond Industrial Co., Ltd.
InventorsIsao Ueoka, Jun Sugawara, Akira Mizoguchi, Hideo Oshita, Masaaki Yamanaka, Hideki Ogawa, Nobuo Urakawa, Hirotoshi Yoshinaga
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The present invention provides a wire saw for use in cutting works of electronics materials or optical materials and a method for manufacturing the same, said wire saw having the following characteristic features. Namely, onto a high-strength core wire 2, abrasive grains 3 having a grain size not smaller than two-thirds the thickness of a layer of resin bond 4 on said core wire 2 but not exceeding a half the diameter of said core wire are fixed with said resin bond, said resin bond containing a filler having a grain size smaller than two-thirds the thickness of said resin bond layer. The thus structured and arranged wire saw has an improved efficiency and precision in cutting. The wire saw can be manufactured readily by using an enamelling oven.
A wire saw comprising a high-strength core wire, a layer of a resin bond coating said core wire, a resin of said resin bond having a modulus of elasticity of 100 kg/mm.sup.2 are above and a softening temperature of 200.degree. C. or above and said resin bond containing filler having a grain size smaller than two-thirds the thickness of said resin bond layer, and abrasive grains fixed in said resin bond layer and having a grain size not smaller than two-thirds the thickness of said resin bond layer but not exceeding a half the diameter of said core wire.
A method for producing a wire saw comprising preparing a coating composition containing a resin bond, coating a core with said coating composition and heating the same so as to form a layer of said resin bond fixed onto the outer peripheral surface of said core wire, said coating composition comprising said resin bond, a resin of said resin bond having a modulus of elasticity of 100 kg/mm2 or above and a softening temperature of 200.degree. C. or above, abrasive grains having a grain size not smaller than two-thirds the thickness of said resin bond layer but not exceeding a half the diameter of said core wire and filler having a grain size smaller than two-thirds the thickness of said resin bond layer, said abrasive grains and said filler being added to a solution of said resin in a solvent.
Dependencies are inferred from the claim text.