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US 2025/0050542 A1Published application
Method for cutting silicon ingot
AssigneeSumco Corporation
InventorDaisuke HASHIMOTO
Life of this patent
Estimating the term…
Abstract
A method for cutting a silicon ingot includes cutting a silicon ingot by causing a fixed-abrasive-grain wire to run at a speed in which the maximum speed is 1,200 m/minute or higher while supplying a coolant in which the percentage of water is more than 99%.
Claims8
A method for cutting a silicon ingot, the method comprising:
- cutting a silicon ingot by causing a fixed-abrasive-grain wire to run at a speed in which a maximum speed is 1,200 m/minute or higher while supplying a coolant in which a percentage of water is more than 99%.
Dependencies are inferred from the claim text.