B23K 3/047
Electric
Official title: electric
B23K3/047 (Electric) appears on 307 US grants and 249 published applications in this corpus.
Search patents in B23K- Granted patents
- 307
- Published applications
- 249
- Assignees
- 179
- Inventors
- 632
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 4 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 5 | 0 |
| 1987 | 14 | 0 |
| 1988 | 7 | 0 |
| 1989 | 9 | 0 |
| 1990 | 10 | 0 |
| 1991 | 17 | 0 |
| 1992 | 12 | 0 |
| 1993 | 6 | 0 |
| 1994 | 11 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 3 |
| 2002 | 5 | 4 |
| 2003 | 2 | 3 |
| 2004 | 4 | 4 |
| 2005 | 0 | 5 |
| 2006 | 5 | 5 |
| 2007 | 3 | 3 |
| 2008 | 1 | 2 |
| 2009 | 1 | 13 |
| 2010 | 2 | 8 |
| 2011 | 3 | 4 |
| 2012 | 4 | 8 |
| 2013 | 5 | 9 |
| 2014 | 7 | 10 |
| 2015 | 13 | 12 |
| 2016 | 6 | 19 |
| 2017 | 15 | 18 |
| 2018 | 12 | 7 |
| 2019 | 14 | 19 |
| 2020 | 17 | 19 |
| 2021 | 16 | 16 |
| 2022 | 14 | 13 |
| 2023 | 11 | 7 |
| 2024 | 10 | 22 |
| 2025 | 11 | 6 |
| 2026 | 8 | 10 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Repair of solder bumps29 Sep 2026US 12,746,613 B2Orbotech Ltd.
- Network for controlling soldering systems and method therefor8 Sep 2026US 12,728,469 B2ERSA GmbH
- Solder reflow apparatus and method of manufacturing an electronic device4 Aug 2026US 12,697,671 B2Samsung Electronics Co., Ltd.
- Device and method for controlled heat transfer, in particular to workpieces of large dimensions and masses by means of a condensing liquid26 May 2026US 12,636,723 B2
- Semiconductor manufacturing equipment21 Apr 2026US 12,605,784 B2
- Heater cartridge and hot air device17 Sep 2026US 2026/0273641 A1
- Brazing process23 Jul 2026US 2026/0208280 A1Optoprim S.R.L.
- Preheating mechanism of jet soldering apparatus, and jet soldering apparatus16 Jul 2026US 2026/0199996 A1Koki Tec Corp.
- Laser compression bonding device and method4 Jun 2026US 2026/0157214 A1STATS ChipPAC Management Pte. Ltd.
- Soldering apparatus9 Apr 2026US 2026/0097444 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Heater-sensor complex502US 6,054,678 AHakko Corporation · 2000
- Shielded heating element having intrinsic temperature control281US 4,701,587 AMetcal, Inc. · 1987
- Autoregulating heater230US 4,752,673 AMetcal, Inc. · 1988
- Autoregulating, electrically shielded heater222US 4,695,713 AMetcal, Inc. · 1987
- Slotted autoregulating heater200US 4,717,814 AMetcal, Inc. · 1988