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US 12,605,784 B2Granted
Semiconductor manufacturing equipment
OwnerCheolan Kwon, Jingyu Mooninventors
Life of this patent
Estimating the term…
Abstract
Semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.
Claims19
Semiconductor manufacturing equipment comprising:
- a main body including a bonding head;
- a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed upward from the thermal compression surface and the negative pressure channels including first holes, respectively, therein;
- and
- a bonding tool including a first surface, a second surface, and grooves recessed downward from the first surface, the first surface configured to contact the thermal compression surface, the second surface being opposite to the first surface and configured to contact a semiconductor chip for a thermal compression,
- wherein the grooves are in communication with the negative pressure channels so that a negative pressure supplied to the first holes is applied to the negative pressure channels and the grooves together, and
- in a plan view, the negative pressure channels overlap the grooves, respectively, such that each of the negative pressure channels is within a corresponding one of the grooves.
3 more elements
Semiconductor manufacturing equipment comprising:
- a main body including a bonding head;
- a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including first holes, respectively, therein;
- and
- a bonding tool including a first surface, a second surface, and grooves at the first surface, the first surface configured to contact the thermal compression surface, the second surface being opposite to the first surface and configured to contact a semiconductor chip for thermal compression,
- wherein the thermal compression surface has a rectangular shape with a first cut-out portion and a second cut-out portion removed inward from a pair of opposite edges of the rectangular shape, respectively, and
- wherein the grooves are in communication with the negative pressure channels so that a negative pressure supplied to the first holes is applied to the negative pressure channels and the grooves together.
3 more elements
Semiconductor manufacturing equipment comprising:
- a main body including a bonding head;
- a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface, and the negative pressure channels including first holes, respectively, therein;
- and
- a bonding tool including a first surface, a second surface, and grooves at the first surface, the first surface configured to contact the thermal compression surface, the second surface being opposite to the first surface and configured to contact a semiconductor chip for thermal compression,
- wherein the negative pressure channels on the thermal compression surface are within the grooves on the first surface, respectively, in a plan view so that a negative pressure supplied to the first holes is applied to the negative pressure channels and the grooves together, at least a portion of an upper boundary of each of the grooves on the first surface is defined by the thermal compression surface,
- wherein an outer side boundary of one of the negative pressure channels and an outer side boundary of one of the grooves corresponding thereto are spaced apart by a first interval in a range between 0.1 mm and 2 mm, and
- wherein vertices of the grooves on the first surface are rounded, the vertices of the grooves each being a point at which two edges of the outer side boundary thereof meet each other, and a vertical level difference between each of bottom boundaries of the grooves to the first surface and the first surface is constant.
4 more elements
Dependencies are inferred from the claim text.