B23K 3/0471
Using resistance rod or bar
Official title: {using resistance rod or bar, e.g. carbon silica}
B23K3/0471 (Using resistance rod or bar) appears on 57 US grants and 21 published applications in this corpus.
Search patents in B23K- Granted patents
- 57
- Published applications
- 21
- Assignees
- 35
- Inventors
- 77
- Latest grant
- 23 Dec 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 5 | 0 |
| 1990 | 7 | 0 |
| 1991 | 7 | 0 |
| 1992 | 4 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 1 |
| 2002 | 2 | 3 |
| 2003 | 1 | 0 |
| 2004 | 1 | 1 |
| 2005 | 0 | 0 |
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 0 |
| 2009 | 0 | 1 |
| 2010 | 1 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 2 |
| 2013 | 0 | 0 |
| 2014 | 0 | 1 |
| 2015 | 2 | 0 |
| 2016 | 3 | 3 |
| 2017 | 3 | 2 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 3 | 1 |
| 2021 | 0 | 1 |
| 2022 | 1 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 2 |
| 2025 | 2 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Solder reflow apparatus and method of manufacturing electronic device23 Dec 2025US 12,506,110 B2Samsung Electronics Co., Ltd.
- Brazing probe26 Aug 2025US 12,397,360 B2Carrier Corporation
- Method for producing a heat exchanger13 Sep 2022US 11,440,080 B2Mahle International GmbH
- Method for producing an especially large aeronautical part11 Aug 2020US 10,737,343 B2Safran Nacelles
- Variable temperature controlled soldering iron14 Jul 2020US 10,716,220 B2OK International, Inc.
- Solder reflow apparatus and method of manufacturing electronic device31 Oct 2024US 2024/0363579 A1Samsung Electronics Co., Ltd.
- Brazing probe11 Jan 2024US 2024/0009746 A1Carrier Corporation
- Method for producing a heat exchanger23 Sep 2021US 2021/0291253 A1Mahle International GmbH
- Variable temperature controlled soldering iron21 May 2020US 2020/0163226 A1OK International, Inc.
- Variable temperature controlled soldering iron28 Nov 2019US 2019/0364668 A1OK International, Inc.
Most cited
By later US patents
- Outer lead bonding head and method of bonding outer lead23US 5,113,581 AMatsushita Electric Industrial Co., Ltd. · 1992
- Heated tool with non-flat heating surface for avoiding solder-bridging18US 4,918,277 AProductech Inc. · 1990
- Micro-soldering tool17US 4,255,644 ACompagnie Internationale l'Informatique-CUU Honeywell Bull · 1981
- Reflow soldering self-aligning fixture14US 6,241,141 B1Unitek Corporation · 2001
- Connecting apparatus14US 6,264,089 B1Kabushiki Kaisha Toshiba · 2001