Solder reflow apparatus and method of manufacturing electronic device

A solder reflow apparatus comprising:

• a vapor generating chamber configured to accommodate a heat transfer fluid on a bottom thereof;
• a heater configured to heat the heat transfer fluid to generate saturated vapor from the heat transfer fluid;
• at least one substrate stage configured to support a substrate having an electronic device mounted thereon via a solder;
• a vertical transfer portion including a vertical conveyor supported by a driving pulley and a driven pulley so as to be rotatable in an endless track and have a conveying route including a descending path and an ascending path in the vapor generating chamber;
• and
• a fastening portion configured to fixedly fasten the at least one substrate stage to one side of the vertical conveyor,
• wherein an inner space of the vapor generating chamber is divided into different zones according to a distribution of the saturated vapor generated when the heat transfer fluid is heated,
• the different zones in the vapor generating chamber have different temperatures, and
• the vertical conveyor is configured to transport the at least one substrate stage along the conveying route through the different zones of the vapor generating chamber in a vertical direction, to thereby obtain a desired soldering temperature profile.

A solder reflow apparatus, comprising:

• a vapor generating chamber configured to accommodate a heat transfer fluid and a distribution of saturated vapor generated from the heat transfer fluid according to a density difference when the heat transfer fluid is heated;
• a heater configured to heat the heat transfer fluid accommodated within the vapor generating chamber;
• a vertical conveyor having a conveying route including a descending path and an ascending path within the vapor generating chamber;
• a plurality of substrate stages fixedly fastened to the vertical conveyor, the plurality of substrate stages being movable upward and downward in the vapor generating chamber along the conveying route of the vertical conveyor, the plurality of substrate stages being spaced apart from each other along an extending direction of the vertical conveyor;
• a fastening portion configured to fixedly fasten a corresponding one of the plurality of substrate stages to one side of the vertical conveyor, wherein
• each of the plurality of substrate stages is configured to support a substrate on which an electronic component is mounted via a solder,
• the fastening portion includes a support shaft, and
• the support shaft is rotatable with respect to a central axis of the support shaft.