B23K 20/26
Auxiliary equipment
B23K20/26 (Auxiliary equipment) appears on 266 US grants and 327 published applications in this corpus.
Search patents in B23K- Granted patents
- 266
- Published applications
- 327
- Assignees
- 203
- Inventors
- 816
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 4 | 1 |
| 2002 | 3 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 2 |
| 2005 | 1 | 6 |
| 2006 | 1 | 4 |
| 2007 | 1 | 1 |
| 2008 | 2 | 0 |
| 2009 | 6 | 2 |
| 2010 | 4 | 4 |
| 2011 | 1 | 11 |
| 2012 | 5 | 5 |
| 2013 | 4 | 11 |
| 2014 | 10 | 11 |
| 2015 | 17 | 19 |
| 2016 | 13 | 18 |
| 2017 | 10 | 24 |
| 2018 | 17 | 25 |
| 2019 | 17 | 27 |
| 2020 | 16 | 17 |
| 2021 | 19 | 14 |
| 2022 | 20 | 28 |
| 2023 | 16 | 22 |
| 2024 | 26 | 33 |
| 2025 | 23 | 24 |
| 2026 | 19 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wire bonding apparatus and control method8 Sep 2026US 12,728,478 B2Kioxia Corporation
- Reducing material for gas pressure welding and gas pressure welding method1 Sep 2026US 12,722,222 B2Murayoshi Gas Pressure Welding Industry Co., Ltd.
- Wire bonding apparatus and control method28 Jul 2026US 12,695,111 B2Hirata Corporation
- Wire bonding systems and related methods of forming a vertical wire structure21 Jul 2026US 12,686,071 B2Kulicke and Soffa Industries, Inc.
- Manufacturing apparatus30 Jun 2026US 12,667,905 B2Panasonic Intellectual Property Management Co., Ltd.
- Composite Current Collector Double-sided Double Ultrasonic Roller Welding System1 Oct 2026US 2026/0295714 A1Sheng Dong Li (Guangzhou) Ultrasonic Electronic Equipment Co., Ltd.
- Methods of cutting a wire on a wire bonding system, and related cutting blades and wire bonding systems10 Sep 2026US 2026/0264165 A1Kulicke and Soffa Industries, Inc.
- Welding device27 Aug 2026US 2026/0249384 A1LG Energy Solution, Ltd.
- Pneumatic wire threading device and method27 Aug 2026US 2026/0249403 A1Asmpt Singapore Pte. Ltd.
- Wire feed system for wire bonding solar cells30 Jul 2026US 2026/0216814 A1Maxeon Solar Pte. Ltd.
Most cited
By later US patents
- Laser processing method and laser processing apparatus293US 6,992,026 B2Hamamatsu Photonics K.K. · 2006
- Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object117US 7,396,742 B2Hamamatsu Photonics K.K. · 2008
- Laser processing method and laser processing apparatus100US 7,547,613 B2Hamamatsu Photonics K.K. · 2009
- Laser cutting by forming a modified region within an object and generating fractures100US 7,626,137 B2Hamamatsu Photonics K.K. · 2009
- Laser processing method and laser processing apparatus98US 7,732,730 B2Hamamatsu Photonics K.K. · 2010