B23K 1/0053
Soldering by means of infrared [ir]
Official title: {soldering by means of infrared [IR]}
B23K1/0053 (Soldering by means of infrared [ir]) appears on 91 US grants and 65 published applications in this corpus.
Search patents in B23K- Granted patents
- 91
- Published applications
- 65
- Assignees
- 69
- Inventors
- 230
- Latest grant
- 9 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 5 | 0 |
| 1987 | 2 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 0 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 2 | 0 |
| 1999 | 3 | 0 |
| 2000 | 3 | 0 |
| 2001 | 2 | 0 |
| 2002 | 2 | 6 |
| 2003 | 5 | 3 |
| 2004 | 2 | 4 |
| 2005 | 4 | 3 |
| 2006 | 0 | 3 |
| 2007 | 0 | 0 |
| 2008 | 3 | 1 |
| 2009 | 1 | 2 |
| 2010 | 0 | 3 |
| 2011 | 1 | 1 |
| 2012 | 1 | 0 |
| 2013 | 0 | 2 |
| 2014 | 2 | 5 |
| 2015 | 2 | 1 |
| 2016 | 2 | 5 |
| 2017 | 3 | 5 |
| 2018 | 2 | 1 |
| 2019 | 4 | 5 |
| 2020 | 0 | 1 |
| 2021 | 3 | 4 |
| 2022 | 4 | 4 |
| 2023 | 2 | 3 |
| 2024 | 4 | 1 |
| 2025 | 1 | 2 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Reflow method and system9 Jun 2026US 12,649,194 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Method for transferring electronic device11 Feb 2025US 12,224,263 B2Micraft System Plus Co., Ltd.
- Reflow method and system24 Dec 2024US 12,176,319 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Device for soldering17 Sep 2024US 12,090,577 B2Siegfried Hofmann GmbH
- Method for transferring electronic device30 Apr 2024US 11,973,054 B2Stroke Precision Advanced Engineering Co., Ltd.
- Reflow method and system27 Feb 2025US 2025/0070077 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Tabbing device for manufacturing solar cell module preventing oversoldering23 Jan 2025US 2025/0031480 A1Hanwha Solutions Corporation
- Method for transferring electronic device27 Jun 2024US 2024/0213209 A1Stroke Precision Advanced Engineering Co., Ltd.
- Reflow method and system22 Jun 2023US 2023/0197671 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Soldering printed circuits using radiant heat22 Jun 2023US 2023/0199971 A1Microsoft Technology Licensing, LLC
Most cited
By later US patents
- Method and process of contract to a heat softened solder ball array67US 6,329,637 B1Micron Technology, Inc. · 2001
- Focused convection reflow soldering method and apparatus63US 4,771,929 AHollis Automation, Inc. · 1988
- Method and process of contact to a heat softened solder ball array46US 6,967,307 B2Micron Technology, Inc. · 2005
- Multi-zone thermal process system utilizing nonfocused infrared panel emitters39US 4,833,301 AVitronics Corporation · 1989
- Method and arrangement for reflow soldering and reflow unsoldering of circuit boards37US 4,832,249 ALicentia Patent-Verwaltungs-G.m.b.H. · 1989