Device for soldering

A device for soldering of at least one assembly, having a process chamber arrangement, comprising at least two process chambers for preparing a soldering method and/or for carrying out a soldering method and/or for post-processing a soldering method, wherein the at least two process chambers are arranged above one another, comprising:

• a handling unit including at least one transfer device, the at least one transfer device comprising at least one transfer means for executing a transfer movement, wherein by means of the transfer means at least one assembly that is to be soldered and/or has been soldered is transferable
• from a non-working position to a first working position lying in an interior of a first process chamber, and/or
• from a first working position lying in the interior of the first process chamber to the non-working position, and/or
• from the first working position lying in the interior of the first process chamber to a second working position,
• wherein the transfer means is movably supported such that the transfer means can protrude or protrudes at least in sections temporarily into an interior space of the process chamber,
• wherein the process chamber arrangement is arranged on a first side of the device and the handling unit is arranged on a second side of the device, and
• wherein the at least one assembly to be soldered is inserted into the handling unit from a location outside the device via the second side of the device and the at least one assembly that has been soldered is removed from the handling unit to the location outside the device via the second side of the device.