Multek Technologies Limited
Irvine, CA, US· latest recorded location
Multek Technologies Limited is named on 23 US grants and 11 published applications in this corpus. Its most frequent classification is H05K (Printed circuits).
- Granted patents
- 23
- Published applications
- 11
- Inventors
- 18
- Granted in 2026 so far
- 0
- Most recent grant
- 8 Sep 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2016 | 2 | 0 |
| 2017 | 7 | 9 |
| 2018 | 7 | 0 |
| 2019 | 5 | 0 |
| 2020 | 2 | 1 |
| 2021 | 0 | 1 |
By publication year.
Technology areas
Share of 34 documents
- H05KPrinted circuits30
- Y10TTechnical subjects covered by former us classification5
- G01MTesting static or dynamic balance of machines or structures2
- G02BOptical elements, systems or apparatus2
- G08BSignalling systems2
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by2
- A41DOuterwear1
- A45CPurses1
- B29CShaping or joining of plastics1
- B29LIndexing scheme associated with subclass b29c, relating to particular articles1
Recent patents
- Dummy core restrict resin process and structure8 Sep 2020US 10,772,220 B2
- Measuring complex PCB-based interconnects in a production environment14 Jul 2020US 10,712,398 B1
- Stretchable flexible durable pressure sensor5 Nov 2019US 10,466,118 B1
- Inline metrology on air flotation for PCB applications29 Oct 2019US 10,458,778 B2
- 3D printed fiber optics22 Oct 2019US 10,449,729 B1
- Resin flow restriction process and structure9 Dec 2021US 2021/0385952 A1
- Dummy core restrict resin process and structure9 Jan 2020US 2020/0015365 A1
- Split via second drill process and structure23 Nov 2017US 2017/0339788 A1
- Disconnect cavity by plating resist process and structure2 Nov 2017US 2017/0318685 A1
- Embedded cavity in printed circuit board by solder mask dam21 Sep 2017US 2017/0271734 A1
Most cited
By later US patents
- Mechanical measures to limit stress and strain in deformable electronics8US 9,521,748 B12016
- PCB hybrid redistribution layer6US 10,009,992 B22018
- Selective segment via plating process and structure6US 9,867,290 B22018
- Stress relief for rigid components on flexible circuits5US 9,560,746 B12017
- Diffuse fiber optic lighting for luggage4US 10,123,603 B12018