Dummy core restrict resin process and structure

A printed circuit board set form comprising:

• a. a plurality of printed circuit boards aligned within a common plane, wherein each printed circuit board is mechanically connected by a common substrate, further wherein each printed circuit board comprises:
• i. a rigid printed circuit board portion comprising a laminated stack of a plurality of non-conducting layers and a plurality of conductive layers, wherein the laminated stack further comprises a first portion of an inner core structure;
• and
• ii. a flexible printed circuit board portion comprising a second portion of the inner core structure, wherein the inner core structure is a continuous structure that extends through both the rigid printed circuit board portion and the flexible printed circuit board portion, further wherein the second portion of the inner core structure comprises inner core circuitry and exposed coverlay material covering the inner core circuitry;
• and
• b. a breakaway substrate aligned within the common plane and mechanically connected around a perimeter of the connected plurality of printed circuit boards, wherein the breakaway substrate includes a dummy core portion.

A method of manufacturing a printed circuit board comprising:

• a. forming an inner core structure having an inner core circuitry on at least one surface of the inner core structure;
• b. applying a coverlay material over the inner core circuitry;
• c. forming a printed circuit board stack up, wherein the printed circuit board stack up comprises the inner core structure, a dummy core, one or more non-conductive layers and one or more conductive layers, wherein the dummy core is stacked on the coverlay material;
• d. laminating the printed circuit board stack up, thereby forming a laminated stack;
• e. forming a depth controlled rout from a surface of the laminated stack to the dummy core and around a perimeter of the dummy core, wherein a portion of the laminated stack within the perimeter of the rout and to a depth including the dummy core forms a laminated stack cap;
• f. removing the laminated stack cap, thereby exposing the coverlay material and forming a flexible portion of the printed circuit board.