Mechanical measures to limit stress and strain in deformable electronics
AssigneeMultek Technologies Limited
InventorsMark Bergman, Joan K. Vrtis
Life of this patent
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Abstract
Mechanical measures strengthen a flexible circuit board or deformable electronic by manipulating the location and/or intensity of the stress concentration or to limit bending, torsion, and stretching. A material layer is patterned onto the flexible circuit board with a specific pattern and place of deposition in order to modify the stress concentration and profile of the circuit board and increase its overall strength. The material layer may be configured to modify the stress concentrations during bending away from the weak points in the assembly or to spread the stress during bending by increasing the radius of the bend curvature and therefore decreasing the chance of mechanical failure.
Claims24
A deformable electronic comprising:
- a. a deformable electronic body comprising a flexible base with one or more rigid component layers and one or flexible component layers coupled to the flexible base;
- and
- b. one or more material layers deposited throughout the body with a material pattern comprising a combination of interlocking shapes, the one or more material layers attached at a specific location to modify the stress concentration of the deformable electronic and increase its overall strength.
A method of strengthening a deformable electronic comprising:
- a. patterning one or more material layers into a pattern comprising a combination of interlocking shapes based upon one or more characteristic of the deformable electronic;
- and
- b. depositing one or more material layers throughout the deformable electronic, wherein the pattern of the one or more material layers and the deposition placement of the one or more material layers modifies the stress concentration of the deformable electronic in order to increase its overall strength.
Dependencies are inferred from the claim text.