Split via second drill process and structure

A method of manufacturing a printed circuit board comprising:

• a. forming a laminated stack of a plurality of non-conductive layers and a plurality of conductive layers;
• b. forming a through hole through the laminated stack;
• c. plating side walls of the through hole to form a plated through hole;
• d. forming a plurality of second through holes through the laminated stack, each second through hole is aligned to overlap an edge of the plated through hole such that plating of the plated through hole coincident with each of the second through holes is removed, wherein remaining plating in the plating through hole forms a plurality of separate circuit paths;
• and
• e. pattern etching an outer conductive layer of the laminated stack to form a plurality of conductive interconnects, wherein each of the conductive interconnects is coupled to a corresponding one of the plurality of separate circuit paths.