Esec AG
Cham, CH· latest recorded location
ESEC AG is named on 24 US grants and 8 published applications in this corpus. Its most frequent classification is H10W (Generic packages, interconnections, connectors or other constructional details of devices covered by).
- Granted patents
- 24
- Published applications
- 8
- Inventors
- 43
- Granted in 2026 so far
- 0
- Most recent grant
- 21 Mar 2017
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 6 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 4 |
| 2011 | 0 | 1 |
| 2012 | 3 | 1 |
| 2013 | 1 | 2 |
| 2014 | 1 | 0 |
| 2015 | 1 | 0 |
| 2016 | 0 | 0 |
| 2017 | 1 | 0 |
By publication year.
Technology areas
Share of 32 documents
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by22
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered14
- Y10TTechnical subjects covered by former us classification14
- B23KSoldering or unsoldering11
- H05KPrinted circuits5
- B06BMethods or apparatus for generating or transmitting mechanical vibrations of infrasonic, sonic2
- G01BMeasuring length, thickness or similar linear dimensions2
- B23QDetails, components, or accessories for machine tools1
- C30BSingle-crystal growth1
- F16CShafts1
Recent patents
- Apparatus for mounting semiconductor chips21 Mar 2017US 9,603,294 B2
- Method and apparatus for mounting semiconductor chips14 Jul 2015US 9,082,816 B2
- Method for detaching and removing a semiconductor chip from a foil6 May 2014US 8,715,457 B2
- Method for dispensing solder on a substrate and method for mounting semiconductor chips5 Nov 2013US 8,573,467 B2
- Die ejector28 Aug 2012US 8,250,742 B2
- Apparatus For Mounting Semiconductor Chips30 May 2013US 2013/0133188 A1
- Method And Apparatus For Mounting Semiconductor Chips10 Jan 2013US 2013/0008599 A1
- Method For Dispensing Solder On A Substrate And Method For Mounting Semiconductor Chips29 Nov 2012US 2012/0298730 A1
- Method For Detaching And Removing A Semiconductor Chip From A Foil8 Sep 2011US 2011/0214819 A1
- Method And Device For Measuring A Height Difference16 Dec 2010US 2010/0315655 A1
Most cited
By later US patents
- Curing oven for magazine holding computer chip lead frames, providing flow direction control for hot gas stream349US 5,569,402 A1996
- Apparatus for performing in-feed of working member to working station20US 5,114,302 A1992
- Ultrasonic transducer with a flange for mounting on an ultrasonic welding device, in particular on a wire bonder20US 6,135,339 A2000
- Method and apparatus for dispensing liquid solder18US 5,878,939 A1999
- Semi-conductor mounting apparatus for applying adhesive to a substrate17US 6,129,040 A2000