US 2013/0008599 A1Published application

Method And Apparatus For Mounting Semiconductor Chips

AssigneeEsec AG

InventorsMarco Graf, Dominik Hartmann, Juergen Stuerner

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Abstract

A semiconductor mounting apparatus has a dispensing station configured to dispense adhesive portions to the substrate locations of a substrate, a bonding station configured to place semiconductor chips on the substrate locations and a transport device configured to transport the substrates along a transport path. The transport device includes a buffer station disposed between the dispensing station and the bonding station. The buffer station is configured to temporarily remove a substrate which is to be transported from the dispensing station to the bonding station, or in reverse direction, from the transport path so that another substrate can be transported by the transport device from the bonding station to the dispensing station, or in reverse direction, respectively.

Claims6

Dependent claims

A method for mounting semiconductor chips, in which at a dispensing station one adhesive portion after the other is dispensed to substrate locations of a substrate and at a bonding station one semiconductor chip after the other is placed on the substrate locations provided with adhesive, the method comprising

dividing the substrates into at least two sub-regions, and mounting the semiconductor chips on each such substrate according to the following steps:
A) transporting the substrate to the dispensing station,
B) dispensing an adhesive portion to each of the substrate locations of the first sub-region of the substrate,
C) transporting the substrate to the bonding station,
D) placing semiconductor chips on the substrate locations of the first sub-region of the substrate,
E) transporting the substrate back to the dispensing station,
F) dispensing an adhesive portion to each of the substrate locations of the second sub-region of the substrate,
G) transporting the substrate to the bonding station, and
H) placing semiconductor chips on the substrate locations of the second sub-region of the substrate and transporting the substrate to an outlet if the number of the sub-regions is two or repeating steps E to H for each further sub-region of the substrate,
wherein the substrate in step E crosses in a buffer station disposed between the dispensing station and the bonding station one or two successive substrates which are transported from the dispensing station to the bonding station.

7 more elements

An apparatus for mounting semiconductor chips, the apparatus comprising:

a dispensing station configured to dispense adhesive portions to the substrate locations of a substrate,
a bonding station configured to place semiconductor chips on the substrate locations provided with adhesive,
a transport device configured to transport the substrates along a transport path which leads from an inlet to the dispensing station, from the dispensing station to the bonding station and from the bonding station to an outlet, and
a buffer station disposed between the dispensing station and the bonding station and configured to
(A) temporarily receive from the transport device a substrate which is to be transported from the dispensing station to the bonding station and remove the substrate from the transport path so that another substrate can be transported by the transport device from the bonding station to the dispensing station, or
(B) temporarily receive from the transport device a substrate which is to be transported from the bonding station to the dispensing station and remove the substrate from the transport path so that another substrate can be transported by the transport device from the dispensing station to the bonding station.

3 more elements

Dependencies are inferred from the claim text.